Power Electronic Packaging presents an in-depth overview of power electronic packaging design
assembly reliability and modeling. Since there is a drastic difference between IC fabrication
and power electronic packaging the book systematically introduces typical power electronic
packaging design assembly reliability and failure analysis and material selection so readers
can clearly understand each task's unique characteristics. Power electronic packaging is one of
the fastest growing segments in the power electronic industry due to the rapid growth of power
integrated circuit (IC) fabrication especially for applications like portable consumer home
computing and automotive electronics. This book also covers how advances in both semiconductor
content and power advanced package design have helped cause advances in power device capability
in recent years. The author extrapolates the most recent trends in the book's areas of focus to
highlight where further improvement in materials and techniques can drive continued
advancements particularly in thermal management usability efficiency reliability and
overall cost of power semiconductor solutions.
