Power Electronic Packaging - Yong Liu Gebunden

Power Electronic Packaging presents an in-depth overview of power electronic packaging design assembly reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging the book systematically introduces typical power electronic packaging design assembly reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry due to the rapid growth of power integrated circuit (IC) fabricat ion especially for applications like portable consumer home computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements particularly in thermal management usability efficiency reliability and overall cost of power semiconductor solutions.