This book is a must-have reference to dry etching technology for semiconductors which will
enable engineers to develop new etching processes for further miniaturization and integration
of semiconductor integrated circuits. The author describes the device manufacturing flow and
explains in which part of the flow dry etching is actually used. The content is designed as a
practical guide for engineers working at chip makers equipment suppliers and materials
suppliers and university students studying plasma focusing on the topics they need most such
as detailed etching processes for each material (Si SiO2 Metal etc) used in semiconductor
devices etching equipment used in manufacturing fabs explanation of why a particular plasma
source and gas chemistry are used for the etching of each material and how to develop etching
processes. The latest key technologies are also described such as 3D IC Etching Dual
Damascene Etching Low-k Etching Hi-k Metal Gate Etching FinFET Etching Double Patterning
etc.
