This work takes advantage of high-resolution silicon stencil masks to build air-stable
complementary OTFTs using a low-temperature fabrication process. Plastic electronics based on
organic thin-film transistors (OTFTs) pave the way for cheap flexible and large-area products.
Over the past few years OTFTs have undergone remarkable advances in terms of reliability
performance and scale of integration. Many factors contribute to the allure of this technology
the masks exhibit excellent stiffness and stability thus allowing OTFTs with submicrometer
channel lengths and superb device uniformity to be patterned. Furthermore the OTFTs employ an
ultra-thin gate dielectric that provides a sufficiently high capacitance to enable the
transistors to operate at voltages as low as 3 V. The critical challenges in this development
are the subtle mechanisms that govern the properties of aggressively scaled OTFTs. These
mechanisms dictated by device physics are well described and implemented into circuit-design
tools to ensure adequate simulation accuracy.
