This book is a first attempt to merge two different communities: scientists and technologists.
Therefore it is not a general overview covering all the fields of nanopackaging but is mainly
focused on two topics. The first topic deals with atomic scale devices or circuit requirements
as well as related recent technological developments for example surface science engineering
and atomic scale interconnects studies. The second main part of the book brings CNT
nano-materials solutions for resolving interconnect or thermal management problems in
microelectronics device packaging. This book is not just useful for those who attended the
International Workshop on Nanopackaging in Grenoble but can provide valuable information to
scientists and technologists in the nanopackaging community.
