Intended for wire-bonding and flip-chip packaging professionals and for scientists and
engineers working in the field of mechanical microsensors this practical monograph introduces
novel measurement technologies that allow for in situ and real-time examination of physical
processes during the packaging process or during subsequent reliability tests. The measurement
system presented here makes possible measurements at formerly inaccessible packaging
interconnects. For the first time it becomes possible to describe the wire-bonding process
window in terms of the physical forces at the contact zone instead of the applied machine
settings. This is significant for a deeper understanding and future development of these
packaging processes. Applications of the sensor in the field of wire bonding and flip-chip
characterization are also illustrated. The reader will gain much insight into the important
field of interconnection technology in semiconductor packaging.
