This volume contains the proceedings of the 10th edition of the International Conference on
Simulation of Semiconductor Processes and Devices (SISPAD 2004) held in Munich Germany on
September 2-4 2004. The conference program included 7 invited plenary lectures and 82
contributed papers for oral or poster presentation which were carefully selected out of a
total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings
SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances
and developments in the theoretical description physical modeling and numerical simulation and
analysis of semiconductor fabrication processes device operation and system performance. The
variety of topics covered by the conference contributions reflects the physical effects and
technological problems encountered in consequence of the progressively shrinking device
dimensions and the ever-growing complexity in device technology.
