This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package
(SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a
pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical thermal and
mechanical characteristics. Moreover it is low-cost and requires only standard manufacturing
and assembly techniques. Finally two fully-integrated 122 GHz radar sensors are demonstrated
in LTCC technology.
