The brief primarily focuses on the performance analysis of CNT based interconnects in current
research scenario. Different CNT structures are modeled on the basis of transmission line
theory. Performance comparison for different CNT structures illustrates that CNTs are more
promising than Cu or other materials used in global VLSI interconnects. The brief is organized
into five chapters which mainly discuss: (1) an overview of current research scenario and
basics of interconnects (2) unique crystal structures and the basics of physical properties of
CNTs and the production purification and applications of CNTs (3) a brief technical review
the geometry and equivalent RLC parameters for different single and bundled CNT structures (4)
a comparative analysis of crosstalk and delay for different single and bundled CNT structures
and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
