The book provides accurate FDTDmodels for on-chip interconnects covering most recent
advancements inmaterials and design. Furthermore depending on the geometry and
physicalconfigurations different electrical equivalent models for CNT and GNR
basedinterconnects are presented. Based on the electrical equivalent models theperformance
comparison among the Cu CNT and GNR-based interconnects are alsodiscussed in the book. The
proposed models are validated with the HSPICEsimulations.The book introduces the
currentresearch scenario in the modeling of on-chip interconnects. It presents thestructure
properties and characteristics of graphene based on-chipinterconnects and the FDTD modeling of
Cu based on-chip interconnects. Themodel considers the non-linear effects of CMOS driver as
well as thetransmission line effects of interconnect line that includes couplingcapacitance and
mutual inductance effects. In a more realistic manner theproposed model includes the effect of
width-dependent MFP of the MLGNR whiletaking into account the edge roughness.
