Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind still
needed and capable of keeping pace with the demands posed by ever greater levels of
integration. It spans a wide range of topics from materials properties to limits of what's the
best one can achieve in capacitor properties to process modeling to application examples. Some
of the topics covered are the following: -Novel insights into fundamental relationships between
dielectric constant and the breakdown field of materials and related capacitance density and
breakdown voltage of capacitor structures -Electrical characterization techniques for a wide
range of frequencies (1 kHz to 20 GHz) -Process modeling to determine stable operating points
-Prevention of metal (Cu) diffusion into the dielectric -Measurements and modeling of the
dielectric micro-roughness.
