EAN: 9783030146894

SYSTEMS-LEVEL PACKAGING FOR MILLIMETER-WAVE TRA...

This book provides a system-level approach to making packaging decisions for millimeter-wave
transceivers. In electronics  the packaging forms a bridge between the integrated circuit or
individual device and the rest of the electronic system  encompassing all technologies between
the two. To be able to make well-founded packaging decisions  researchers need to understand a
broad range of aspects  including: concepts of transmission bands  antennas and propagation 
integrated and discrete package substrates  materials and technologies  interconnects  passive
and active components  as well as the advantages and disadvantages of various packages and
packaging approaches  and package-level modeling and simulation. Packaging also needs to be
considered in terms of system-level testing  as well as associated testing and production costs
and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by
addressing the aforementioned concepts and applying them to the context of the millimeter-wave
regime and the unique opportunities that this transmission approach offers.

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