EAN: 9783031005756

SYNTHESIS LECTURES ON COMPUTATIONAL ELECTROMAGN...

This book presents a step-by-step discussion of the 3D integration approach for the development
of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive
building blocks (cavity microstip filters  duplexers  antennas)  as well as a multilayer
ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of
this approach in RF Wireless packaging and multifunctional miniaturization. Designs covered are
based on novel ideas and are presented for the first time for millimeterwave (60GHz)
ultrabroadband wireless modules. Table of Contents: Introduction   Background on Technologies
for Millimeter-Wave Passive Front-Ends   Three-Dimensional Packaging in Multilayer Organic
Substrates   Microstrip-Type Integrated Passives   Cavity-Type Integrated Passives  
Three-Dimensional Antenna Architectures   Fully Integrated Three-Dimensional Passive Front-Ends
References

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