EAN: 9783031006197

SYNTHESIS LECTURES ON COMPUTER ARCHITECTURE D...

The emerging three-dimensional (3D) chip architectures  with their intrinsic capability of
reducing the wire length  promise attractive solutions to reduce the delay of interconnects in
future microprocessors. 3D memory stacking enables much higher memory bandwidth for future
chip-multiprocessor design  mitigating the memory wall problem. In addition  heterogenous
integration enabled by 3D technology can also result in innovative designs for future
microprocessors. This book first provides a brief introduction to this emerging technology  and
then presents a variety of approaches to designing future 3D microprocessor systems  by
leveraging the benefits of low latency  high bandwidth  and heterogeneous integration
capability which are offered by 3D technology.

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