EAN: 9783736994102

DEVELOPMENT OF SUB-MM WAVE FLIP-CHIP INTERCONNE...

With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss
interconnects for module fabrication become essential. This work presents the results of the
flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz. Flip-chip
transitions in this study were fabricated based on simulated 3D models in three different
topologies: coplanar-to-coplanar  stripline-to-coplanar  and stripline-to-stripline. The
interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting 
scattering parameter measurements were performed to characterize the interconnect quality. The
results suggest that the flip-chip technology is currently the most suitable technology for the
high frequency range.

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