EAN: 9783319186740

THREE DIMENSIONAL INTEGRATION OF SEMICONDUCTORS...

This book starts with background concerning three-dimensional integration - including their low
energy consumption and high speed image processing - and then proceeds to how to construct them
and which materials to use in particular situations. The book covers numerous applications 
including next generation smart phones  driving assistance systems  capsule endoscopes  homing
missiles  and many others. The book concludes with recent progress and developments in three
dimensional packaging  as well as future prospects.

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