EAN: 9783319297446

CARBON NANOTUBES FOR INTERCONNECTS GEBUNDEN

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as
interconnect material for horizontal  on-chip and 3D interconnects. The authors demonstrate the
uses of bundles of CNTs  as innovative conducting material to fabricate interconnect
through-silicon vias (TSVs)  in order to improve the performance  reliability and integration
of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of
exploiting carbon nanotubes for 3D interconnects covering aspects from processing  modeling 
simulation  characterization and applications. Coverage also includes a thorough presentation
of the application of CNTs as horizontal on-chip interconnects which can potentially
revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in
the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D
integrated circuits.

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