EAN: 9783642630965

HANDBOOK OF ADVANCED PLASMA PROCESSING TECHNIQU...

Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the
cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods
has also sparked interest in their application to other techniques  such as
surface-micromachined sen sors  read write heads for data storage and magnetic random access
memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions
with the exposed surfaces of semiconductors and other materi als is often overlooked at the
manufacturing stage. In this case  the process is optimized by an informed trial-and-error
approach which relies heavily on design-of-experiment techniques and the intuition of the
process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction
or precursor gas products adds an extra degree of complexity because the interaction of the
reactive species in the plasma with the reactor walls can also have a strong effect on the
number of these species available for etching or deposition. Since the microelectronics
industry depends on having high process yields at each step of the fabrication process  it is
imperative that a full understanding of plasma etching and deposition techniques be achieved.

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