EAN: 4260711991394

TG-MP-A-1-1-2-2 - MINUS PAD ADVANCE - 100X100X2...

With the Thermal Grizzly Minus Pad Advance  the Hamburg-based cooling specialist is expanding
its product range with advanced thermal pads. Based on their predecessor  the Minus Pad 8  they
have been further developed to significantly improve thermal conductivity. The Minus Pad
Advance is ideal for applications where thermal paste is difficult to apply or where a gap
between the heat source and the heat sink needs to be bridged. It is therefore ideal for use
with memory chips or voltage converters. It is based on a silicone-based carrier complex and
aluminum oxide as a heat transfer medium  thus achieving thermal conductivity similar to
thermal paste. The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3
millimeters. Since it works optimally even with minimal contact pressure and thermal
conductivity is barely affected by the thickness  the choice of thickness should simply be
tailored to the distance to be bridged.

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